- high resolution device patterning that needs lower cost fabrication than electron beam direct write, and
does NOT require fine feature to feature overlay - no overlay or overlay down to 200 nm is required. For
example, Optics, Light emitting diodes (LED), Patterned media.
- complex 3 dimensional structures in functional materials. For example; optical elements and bio
structures
- process research for fine overlay applications, typically 30% of the critical dimension. For example; dual
damascene processes, molecular memory, defect studies for devices and molds, line width control
evaluation.
The following are examples that have either been published, or have been discussed as possibilities.
OPTICS
Refractive
Diffractive
Subwavelength
OPTICAL DEVICES
LED
Solar Cells
Displays
Optical disk
Cameras
BIO
Separation
Cell culture
Lab on a chip
MATERIALS
Non wetting surfaces
Silicon recrystallization
Nanoporous films
Catalysts
MEMS
SAW
Molecular Motors
Microfluidics
Sensors
STORAGE
Hard disks - Patterned Media
Optical Disk
ELECTRONICS
Integrated Circuits
Contacts
Dual Damascene
FET
Microwave transistors
Quantum Devices
LED
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